Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JP3707548
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame exhibiting excellent characteristics and having a lead-free plating film.
SOLUTION: On the surface of a basic material composed of copper or an A4 material, a nickel plating layer is formed as an underlying plating layer. On the surface of the nickel plating layer, a plurality of Au-Ag plating layers having different rate of Ag is formed such that the rate of Ag increases from the basic material side toward the surface side thus forming a multilayer Au-Ag plating layer.
Inventors:
Li Ming
Yamaura Daigo
Yamaura Daigo
Application Number:
JP2002066992A
Publication Date:
October 19, 2005
Filing Date:
March 12, 2002
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
C25D5/10; C25D7/00; C25D7/12; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP60254761A |
Attorney, Agent or Firm:
Takahisa Kimura
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