Title:
LEAD-FREE AND ANTIMONY-FREE SOLDER ALLOY, SOLDER BALL, BALL GRID ARRAY, AND SOLDER JOINT
Document Type and Number:
Japanese Patent JP2021171825
Kind Code:
A
Abstract:
To provide: a lead-free and antimony-free solder alloy which has a medium to low melting point and of which the soldering properties can be secured even after being retained at a high temperature for a long period; a solder ball; a ball grid array; and a solder joint.SOLUTION: The lead-free and antimony-free solder alloy has an alloy composition comprising 12 to 23 mass% of In and 0.001 to 0.08 mass% of Ge, with the remainder comprising Sn and unavoidable impurities. Preferably, the content of In in the alloy composition is 16 to 21 mass%, the content of Ge in the alloy composition is 0.005 to 0.01 mass%, the content of Ge in the alloy composition is 0.005 to 0.009 mass%, the content of each of U and Th as unavoidable impurities is 5 mass ppb or less, and the content of each of As and Pb as unavoidable impurities is 5 mass ppm or less.SELECTED DRAWING: Figure 2
Inventors:
SAITO TAKESHI
SUDO HIROKI
SUSA MAI
SUDO HIROKI
SUSA MAI
Application Number:
JP2021082842A
Publication Date:
November 01, 2021
Filing Date:
May 15, 2021
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; C22C13/00; H01L21/60
Attorney, Agent or Firm:
Hideki