Title:
無鉛高強度高潤滑性銅合金
Document Type and Number:
Japanese Patent JP5663500
Kind Code:
B2
Abstract:
A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt. % or 0.10 wt. % lead.
Inventors:
ミスラ、 アビジート
セバスチャン、 ジェイソン
ライト、 ジェイムズ エイ．
セバスチャン、 ジェイソン
ライト、 ジェイムズ エイ．
Application Number:
JP2011553034A
Publication Date:
February 04, 2015
Filing Date:
March 02, 2010
Export Citation:
Assignee:
ケステック イノベーションズ エルエルシー
International Classes:
B22D7/00; C22C9/00; B22D11/00; B22D11/049; B22D21/00; B22D27/04; C22C9/02; C22F1/08
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Field Yuko
Masakazu Ito
Field Yuko