Title:
鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置
Document Type and Number:
Japanese Patent JP6796108
Kind Code:
B2
Abstract:
Provided are: a lead-free solder alloy, which is a means that can achieve both of a cracking propagation prevention effect and resistance to impact associated with high-speed deformation at a solder joint part under an environment where the temperature difference is extreme, and which can be used suitably particularly in an in-vehicle electronic mounted substrate and an in-vehicle electronic control device, the lead-free solder alloy being characterized by containing 2 to 4% by mass inclusive of Ag, 0.3 to 1% by mass inclusive of Cu, 1.5% by mass or more and less than 3% by mass of Bi, and 1% by mass or more and less than 3% by mass of In, with the remainder made up by Sn; a solder paste; an electronic circuit-mounted substrate; and an electronic control device.
Inventors:
Masaya Arai
Ken Nakano
Katsuyama Tsukasa
Soukawa Yurika
Daisuke Maruyama
Takanori Shimazaki
Ken Nakano
Katsuyama Tsukasa
Soukawa Yurika
Daisuke Maruyama
Takanori Shimazaki
Application Number:
JP2018107086A
Publication Date:
December 02, 2020
Filing Date:
June 04, 2018
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K35/26; B23K35/363; C22C13/00; C22C13/02; H05K3/34
Domestic Patent References:
| JP2014037005A | ||||
| JP2016010818A | ||||
| JP2001168519A | ||||
| JP2015205345A |
Foreign References:
| WO2000018536A1 |
Attorney, Agent or Firm:
Yoko Ota