Title:
無鉛ソルダーペースト及びその製造方法
Document Type and Number:
Japanese Patent JP6842500
Kind Code:
B2
Abstract:
This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt% Cu, Sn-(0.5 to 5) wt% Ag, or Sn-(0.1 to 2) wt% Cu-(0.5 to 5) wt% Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.
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Inventors:
Sharma, Ashtosh
Chung, Je-pil
Yun, John, Hyun
Park, Bun, Gyu
Song, Hun, Rak
Im, son, hi
Yun, John, Hyuk
Chung, Je-pil
Yun, John, Hyun
Park, Bun, Gyu
Song, Hun, Rak
Im, son, hi
Yun, John, Hyuk
Application Number:
JP2019100241A
Publication Date:
March 17, 2021
Filing Date:
May 29, 2019
Export Citation:
Assignee:
KYUNG DONG ONE CORPORATION
International Classes:
B23K35/22; B23K35/14; B23K35/26; C22C13/00
Domestic Patent References:
| JP2009519136A | ||||
| JP2013054851A | ||||
| JP2014527466A |
Foreign References:
| US20100200271 | ||||
| WO2006126564A1 |
Attorney, Agent or Firm:
Hiroaki Saegusa