To improve the detection accuracy of a lead wire position of an electronic component.
Light affected by a lead wire 2 of an electronic component 1 enters a second mirror section 23 from a first illumination section 24 via a first mirror section 22. Similarly, light affected by the lead wire 2 of the electronic component 1 enters the first mirror section 22 from a second illumination section 25 via the second mirror section 23. An imaging section 26 acquires images taken on the first mirror section 22 and second mirror section 23 as two-dimensional data. A controller 19 performs the operation of the lead line position based on angle information formed by the data of the imaging section 26 and the first and second mirror sections 22 and 23. The position of the lead wire 2 of the electronic component 1 can be accurately detected without the influence of a rotation error of a target component or the like.
KATSURA HIROAKI
Next Patent: SUBSTRATE INSPECTING DEVICE AND SUBSTRATE INSPECTION METHOD