Title:
LIGHT-CONNECTING DEVICE
Document Type and Number:
Japanese Patent JPH04107972
Kind Code:
A
Abstract:
PURPOSE:To enable assembly to be made easily and quality to be improved by storing a first printed-circuit board where a light-emitting element is packaged and a second printed-circuit board where a light-receiving element is packaged at a constant interval so that the light-emitting element and the light-receiving element face each other within a case. CONSTITUTION:A photo diode array 2 and a high withstand-voltage MOSFET 3 are die-bonded and wire-bonded on a printed-circuit board 4 as a light-receiving element, while an LED 1 which is used as a light-receiving element is die-bonded and wire- bonded on a printed-circuit board 8. A transparent resin 6 is coated on a surface of the light-receiving element 2. These two printed-circuit boards 4 and 8 are stored within a case 10 while maintaining a constant interval so that the light-emitting element 1 and the light-receiving element 2 face each other. Guides 11 and 12 for guiding the printed-circuit boards 4 and 8 are provided within the case 10. After storing them in this manner, they are heated for enabling the transparent resin 6 to be thermoset. After that, a resin for screening light 7 is impregnated between two printed-circuit boards 4 and 8 for thermosetting. With this kind of configuration, it becomes possible to prevent assembly failure due to influence of warpage and burr caused by use of a spacer.
Inventors:
ISHIDA KATSUMI
SHIRAISHI MITSUO
WAKAMATSU KIYOTAKA
NAKAYA MINORU
SHIRAISHI MITSUO
WAKAMATSU KIYOTAKA
NAKAYA MINORU
Application Number:
JP22711690A
Publication Date:
April 09, 1992
Filing Date:
August 29, 1990
Export Citation:
Assignee:
YOKOGAWA ELECTRIC CORP
International Classes:
H01L31/12; (IPC1-7): H01L31/12
Attorney, Agent or Firm:
Masayasu Watanabe