Title:
LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2014197522
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting device having high reliability; to inhibit breakage of an element when an external physical force is applied; or to prevent the resin and wiring which contact a flexible substrate from being damaged due to heat in a process of pressure bonding of an FPC.SOLUTION: A flexible light-emitting device including an organic EL comprises a neutral plane which does not cause stress distortion against deformation and which is located near both of a transistor and the organic EL element. Or, the light-emitting device is composed to have a hard outermost surface. Or, in the light-emitting device, a substrate having a thermal expansion coefficient of 10 ppm/K or lower is used for a substrate which overlaps a terminal part connected to an FPC.
Inventors:
YAMAZAKI SHUNPEI
EGUCHI SHINGO
EGUCHI SHINGO
Application Number:
JP2013097200A
Publication Date:
October 16, 2014
Filing Date:
May 03, 2013
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB
International Classes:
H05B33/02; H01L51/50; H05B33/04; H05B33/06; H05B33/12; H05B33/22; H05B44/00
Domestic Patent References:
| JP2010244698A | 2010-10-28 | |||
| JP2011124228A | 2011-06-23 | |||
| JP2012518892A | 2012-08-16 | |||
| JP2005005143A | 2005-01-06 | |||
| JP2009048942A | 2009-03-05 |
Foreign References:
| WO2010098992A1 | 2010-09-02 |