Title:
発光装置及びその製造方法
Document Type and Number:
Japanese Patent JP7111939
Kind Code:
B2
Abstract:
A method of manufacturing a light emitting device includes: bonding a plurality of light emitting elements each having an outer peripheral lateral surface onto a light-transmissive substrate; forming at least one groove on the light-transmissive substrate to surround an outer periphery of each of the plurality of light emitting elements; disposing at least one light guiding member in the groove to continuously cover the groove and the outer peripheral lateral surfaces of adjacent ones of the plurality of light emitting elements; and singulating the light-transmissive substrate at a position between adjacent ones of the plurality of light emitting elements, to obtain a plurality of light emitting devices in each of which at least one of the light emitting elements is bonded to a single light-transmissive member.
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Inventors:
Takashi Sogai
Application Number:
JP2017089785A
Publication Date:
August 03, 2022
Filing Date:
April 28, 2017
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/58; H01L33/54
Domestic Patent References:
| JP2017050321A | ||||
| JP2013187371A | ||||
| JP2014232866A | ||||
| JP2015138839A | ||||
| JP201512143A | ||||
| JP2014207349A | ||||
| JP20124303A | ||||
| JP2015106620A | ||||
| JP201769368A | ||||
| JP2016127052A | ||||
| JP201717159A | ||||
| JP2016072515A |
Foreign References:
| US20170005245 | ||||
| WO2014091914A1 | ||||
| WO2013111542A1 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation