Title:
発光装置、及び、光学装置
Document Type and Number:
Japanese Patent JP7244745
Kind Code:
B2
Abstract:
A light emitting device includes: at least one semiconductor laser element; a base member on which the at least one semiconductor laser element is disposed; a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface; and a lens member through which the laser light emitted from the at least one semiconductor laser element, the lens member being fixed to the base member or the light-transmissive member. At least the light-transmissive region is made of sapphire. The light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire.
Inventors:
▲高▼鶴 一真
Application Number:
JP2019025353A
Publication Date:
March 23, 2023
Filing Date:
February 15, 2019
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01S5/022; G03B21/14
Domestic Patent References:
| JP2018107348A | ||||
| JP2017208288A | ||||
| JP2012094728A |
Foreign References:
| US20130272329 |
Attorney, Agent or Firm:
Masayuki Kanita
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