Title:
発光デバイス及び発光装置
Document Type and Number:
Japanese Patent JP7353299
Kind Code:
B2
Abstract:
The light emitting device according to an embodiment of the present disclosure includes: a substrate; a semiconductor stacked body; a first electrically conductive layer; a second electrically conductive layer; and a through wiring line. The substrate has a first surface and a second surface that are opposed to each other. The semiconductor stacked body is provided on the first surface of the substrate. The semiconductor stacked body has a plurality of light emitting regions each of which allows a laser beam to be emitted. The first electrically conductive layer is provided on a front surface of the semiconductor stacked body. The front surface is opposite to the substrate. The second electrically conductive layer is provided on the second surface of the substrate. The second electrically conductive layer is provided to allow a predetermined voltage to be applied to the semiconductor stacked body in each of a plurality of the light emitting regions. The through wiring line electrically couples the first electrically conductive layer and the second electrically conductive layer.
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Inventors:
Takahiro Arakida
Application Number:
JP2020558236A
Publication Date:
September 29, 2023
Filing Date:
November 05, 2019
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
H01S5/042; H01S5/026; H01S5/183
Domestic Patent References:
| JP2012023107A | ||||
| JP2017168715A | ||||
| JP2003142775A |
Foreign References:
| US6023485 |
Attorney, Agent or Firm:
Patent Attorney Corporation Tsubasa International Patent Office