Title:
LIGHT EMITTING DIODE ARRAY CHIP
Document Type and Number:
Japanese Patent JPH02260670
Kind Code:
A
Abstract:
PURPOSE:To prevent light emitting dots from becoming irregular in pitch even if two more array chips are arranged in a line by a method wherein two or more light emitting dots are formed in a line at a prescribed pitch on the array chip, and the underside of the lengthwise end face of the array chip is cut out. CONSTITUTION:An LED chip 10 is provided with two or more light emitting dots 11 arranged in a line at a prescribed pitch and the undersides of its lengthwise end faces 12 are cut out. The LED chip 10 is formed by dicing a wafer 20 on which the dots 10 are formed in a straight line. When the wafer 20 is divided into the LED chips 10 by dicing, a groove 15 is previously provided to the side (rear) 13 of the chip 10 which is to be die-bonded to a board 40. The groove 15 is formed by previously cutting out a part which is to be a side 14 (lower side of end face 12) common to both the lengthwise end face 12 of the chip 10 and the rear 13 before the wafer 20 is divided into the LED chips 10.
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Inventors:
KIMOTO MASAHIKO
OTSUKI TERUKAZU
OTSUKI TERUKAZU
Application Number:
JP8321789A
Publication Date:
October 23, 1990
Filing Date:
March 31, 1989
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L21/301; H01L21/78; H01L33/08; (IPC1-7): H01L21/78; H01L33/00
Attorney, Agent or Firm:
Koji Onishi