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Title:
LIQUID SUPPLY DEVICE, AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2014212288
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress drying of a substrate, upon occurrence of serious failure in a substrate processing apparatus.SOLUTION: A pure water supply device 700 includes supply lines 712, 714 for supplying pure water to a substrate W, and valves 721-728 provided in the supply lines 712, 714 and capable of opening and closing the supply lines 712, 714. The pure water supply device 700 includes solenoid valves 772, 774, 776, 778 for opening and closing the supply lines 712, 714 by controlling the opening and closing of the valves 721-728. Furthermore, the pure water supply device 700 includes manual valves 754, 756, 758 capable of opening and closing the supply lines 712, 714 by controlling the opening and closing of the valves 721-728, when the power supply supplying the solenoid valves 772, 774, 776, 778 is lost.

Inventors:
KOSUGE RYUICHI
UMEMOTO MASAO
NAKANO HISAJIRO
SONE CHUICHI
Application Number:
JP2013089254A
Publication Date:
November 13, 2014
Filing Date:
April 22, 2013
Export Citation:
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Assignee:
EBARA CORP
International Classes:
H01L21/304; B24B37/04
Domestic Patent References:
JPH1098017A1998-04-14
JP2011035128A2011-02-17
JP2011187891A2011-09-22
JP2007301661A2007-11-22
JPH1098017A1998-04-14
JP2011035128A2011-02-17
JP2011187891A2011-09-22
JP2007301661A2007-11-22
Attorney, Agent or Firm:
Ono Shinjiro
Miyamae 徹
Kosaku Yamazaki
Yukio Kanegae
Koichi Kushida



 
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