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Title:
LIQUID TREATING DEVICE AND METHOD THEREOF
Document Type and Number:
Japanese Patent JP3635217
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a liquid treating device hardly generating pull-back phenomenon after the discharge port of a feed nozzle leaves the surface of a substrate by scanning the feed nozzle horizontally to the horizontally held substrate to supply a treating liquid, for example, a developer.
SOLUTION: A liquid removing ring formed from a material having larger adhesion to the treating liquid than that to the back surface side of a wafer is provided to surround the substrate horizontally held with a chuck with a small gap. The feed nozzle is moved from one end side to another end side while supplying the treating liquid and the discharge port of the feed nozzle is made close to the top part of the liquid removing ring in the vicinity of another end side of the substrate. Because the treating liquid, through which the discharge port of the feed nozzle and the surface of the substrate are connected to each other by the surface tension, is made flow to the liquid removing ring side to disconnect at this time, excess treating liquid is suppressed to be returned to the surface of the substrate.


Inventors:
Yuji Matsuyama
Shuichi Nagamine
Application Number:
JP28376699A
Publication Date:
April 06, 2005
Filing Date:
October 05, 1999
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
B05D1/40; B05C11/08; G03F7/30; H01L21/00; H01L21/027; B05D1/00; G03F7/16; (IPC1-7): B05C11/08; B05D1/40; G03F7/30; H01L21/027
Domestic Patent References:
JP11244760A
JP4260467A
JP1254277A
JP63018627A
JP10309509A
JP7328510A
Attorney, Agent or Firm:
Toshio Inoue
Mizuno Hiromi



 
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