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Title:
LONG BOARD IN WHICH WOODEN CHIP BUNDLES ARE OBLIQUELY CROSSED, BONDED AND LAMINATED IN MULTIPLE LAYER, MANUFACTURE AND EQUIPMENT THEREOF
Document Type and Number:
Japanese Patent JPH04101803
Kind Code:
A
Abstract:

PURPOSE: To obtain a board-like body for building material covered integrally with wooden split wool by a method wherein wooden chip bundles, the fiber direction of each of which is obliquely intersecting to the four sides of product at an angle of about 45°, are laminated by bonding in multiple layers under the condition being alternately turned by about 90° rightwards and leftwards.

CONSTITUTION: Wooden chip bundle 2a is produced by chipping wooden material 4 such as veneer, wood board or the like parallel to its fiber direction. Next, wooden chip bundles 2b, each of which is prepared by applying adhesive 5 to the wooden chip bundle 2a, are laminated in nearly uniform thickness and extruded normal to the fiber direction so as to successively laminate the extruded wooden chip bundles 2c, which are obliquely and alternately intersected horizontally by the lead-in angle of about 45°, on a laminating conveyor 6 in multiple layers. At this time, wooden split wool 3, which is prepared by being impregnated and mixed with adhesive in advance, is dusted by dusters 8, which are respectively provided at the forefront part and the last part of the laminating conveyor 6. The wooden chip bundles 2c are extruded from extruders 7, which are arranged on both the sides of the laminating conveyor 6, so as to be laminated by bonding under the condition being obliquely intersected one another. Intermediate product 1a obtained as mentioned above is hot-pressed by a hot press 27 consisting of hot platens 26a and 26b vertically standing opposite to each other and laminatingly bonded to one another so as to manufacture board-like body in continuous form.


Inventors:
AIZAWA SUNAO
Application Number:
JP22045490A
Publication Date:
April 03, 1992
Filing Date:
August 21, 1990
Export Citation:
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Assignee:
HASHIMOTO DENKI CO LTD
International Classes:
B27D1/04; B27L11/08; B27N3/04; B27N3/14; (IPC1-7): B27D1/04; B27L11/08; B27N3/04; B27N3/14