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Patent Searching and Data


Title:
LOW-COST THERMAL MANAGEMENT DEVICE OR HEAT SINK MANUFACTURED FROM CONDUCTIVE FILLER-LOADED RESIN-BASED MATERIAL
Document Type and Number:
Japanese Patent JP2004349685
Kind Code:
A
Abstract:

To achieve cost reduction and weight reduction of a system, by using materials other than metal as materials of a heat sink, a heat pipe, or the like.

Materials are used, which are made to uniformly disperse minimal conductive powders, extrafine conductive fibers, or a mixture of those into a resin host material 30. The conductive fibers 38, the conductive powders 34, or the mixture of those are set at about 0.20-0.40 % of the weight. As the conductive minimal powders, for example, nonmetallic powders, such as carbon and graphite, or metallic plated nonmetallic powders may also be used, and metal powders and metallic plated metal powders may also be used. Preferably, as the conductive fibers, nickel plated carbon fibers, stainless steel fibers, copper fibers, and silver fibers, etc. are used. Raw materials in the form of a thin flexible woven fabric can be provided, which can be made into desired shapes by cutting this. As processing methods, for example, injection-molding method, compression-forming method, and extrusion-molding method, etc. may be adopted.


Inventors:
AISENBREY THOMAS
Application Number:
JP2004119383A
Publication Date:
December 09, 2004
Filing Date:
April 14, 2004
Export Citation:
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Assignee:
INTEGRAL TECHNOLOGIES INC
International Classes:
F28D15/02; B29C45/00; G06K19/077; H01L21/48; H01L23/373; H01L23/427; H01Q1/12; H01Q1/24; H01Q1/32; H01Q1/36; H01Q1/38; H01Q1/40; H01Q9/04; H01Q9/16; H01Q9/30; H01Q21/00; H05K3/10; H05K7/20; F21V29/00; H05K1/09; (IPC1-7): H01L23/373; F28D15/02; H05K7/20
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Osamu Hoshino