低融点ガラス組成物、それを用いた低温封着材料及び電子部品

Title:

低融点ガラス組成物、それを用いた低温封着材料及び電子部品

Document Type and Number:

Japanese Patent JP5414409

Kind Code:

B2

Abstract:

A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.

More Like This:

WO/2019/023444	FRIT PASTE AND METHOD FOR SEALING A GLASS ASSEMBLY THEREWITH
WO/2023/275131	JOINT CONNECTION COMPRISING A GLASS, GLASS, IN PARTICULAR FOR PRODUCING A JOINT CONNECTION, AND FEEDTHROUGH COMPRISING A GLASS AND/OR A JOINT CONNECTION, AND METHOD FOR PRODUCING SAME

Inventors:

Takashi Naito
Shinichi Tachizono
Yoshimura Kei
Yuji Hashiba
Keiichi Kanazawa
Shinji Yamada
Satoru Amaha
Hiroki Yamamoto
Takuya Aoyagi

Application Number:

JP2009174883A

Publication Date:

February 12, 2014

Filing Date:

July 28, 2009

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Hitachi Powdered Metals Co., Ltd.

International Classes:

C03C8/08; C03C8/04; C03C8/16; C03C8/18; C03C8/24; H01J5/20; H01J9/26; H01J11/12; H01J11/24; H01J11/26; H01J11/46; H01J11/48

Domestic Patent References:

JP2010052990A
JP2006342044A
JP2007182347A
JP2008308393A
JP2007320822A

Attorney, Agent or Firm:

Manabu Inoue
Yuji Toda

Previous Patent: JPS5414408

Next Patent: JPS5414410