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Patent Searching and Data


Title:
LOW TEMPERATURE COMPUTER SYSTEM
Document Type and Number:
Japanese Patent JPH01155689
Kind Code:
A
Abstract:
PURPOSE:To decrease heat transferred from a normal temperature circuit to a low temperature high speed electronic circuit in amount so as to make the electronic circuit high in data processing speed by a method wherein the low temperature high speed electronic circuit and the normal electronic circuit are arranged close to each other and both the circuits are connected to each other with a signal terminal which is low in thermal conductivity, possessed of a vacuum heat insulating property, and passes through a heat insulating layer. CONSTITUTION:A heat insulating layer 4 is formed between an outer wall 2 and an inner wall 3 of a low temperature retention device 1. A low temperature high speed electronic circuit 5 provided in the device 1 and a normal temperature electronic circuit 6 placed outside the device 1 are arranged close to each other. The circuits 5 and 6 are connected with each other by a signal terminal 7 which low in thermal conductivity and provided with a vacuum heat insulating layer that extends through the outer wall 2, the heat insulating layer 4, and the inner wall 3. Then, a signal transmission line can be shorter than the conventional signal cable, so that the data processing is executed in a low temperature computer system at a high speed. Moreover, heat transferring from the circuit 6 to the circuit 5 can be decreased in amount.

Inventors:
YAMAMOTO HARUHIKO
FUJISAKI AKIHIKO
Application Number:
JP31448887A
Publication Date:
June 19, 1989
Filing Date:
December 11, 1987
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H05K7/20; F25D3/10; G06F1/20; H01L23/44; H01L39/04; (IPC1-7): F25D3/10; H01L23/44; H01L39/04; H05K7/20
Attorney, Agent or Firm:
Masao Yamakawa