Title:
低温硬化被覆組成物及びその方法
Document Type and Number:
Japanese Patent JP4215507
Kind Code:
B2
Abstract:
A method for a low temperature cure for a coating composition comprising: applying to a substrate a low temperature curing coating composition consisting essentially of a film forming component consisting essentially of a non-carbamate functional polymeric component selected from the group consisting of polyester, silicone modified polyester, polyurethane, acrylic, alkyd, epoxy, polyamide, phenolic and polysilane polymers and mixtures thereof; a crosslinking component to crosslink the non-carbamate functional polymeric component; a catalyst selected from the group consisting of Lewis acids, perflouracetic acid, methane sulfonic acid catalyst and mixtures thereof; and additives selected from the group consisting of solvents, flow control agents, pigments, flexibilizing resins, surfactants, waxes, wetting agents, plasticizers, anti-oxidants, UV light absorbers, and a mixture thereof, and subjecting the coated substrate to a cure temperature of between 280° F. and 450° F., for a time sufficient to cure the coating.
Inventors:
Edward Dallas Kevic
Ronald Lewachik
Mark Slafikovsky
Sebastian McCann
Ronald Lewachik
Mark Slafikovsky
Sebastian McCann
Application Number:
JP2002561567A
Publication Date:
January 28, 2009
Filing Date:
October 26, 2001
Export Citation:
Assignee:
BASF Corporation
International Classes:
B05D3/02; C09D201/00; B05D7/14; C08G18/22; C09D133/00; C09D161/28; C09D163/00; C09D167/00; C09D167/08; C09D175/00; C09D175/04; C09D177/00; C09D183/16
Domestic Patent References:
| JP8176465A |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard