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Title:
LOW THERMAL EXPANSION ALLOY, AND LOW THERMAL EXPANSION ALLOY SHEET
Document Type and Number:
Japanese Patent JP2004115905
Kind Code:
A
Abstract:

To provide a low thermal expansion alloy in which the consistency of the thermal expansion coefficient with that of a ceramics material, for example, can be optimized, to provide a low thermal expansion alloy sheet consisting of the low thermal expansion alloy, and to provide an alloy sheet for joining with a ceramics material obtained by using the low thermal expansion alloy sheet.

The low thermal expansion alloy has a composition comprising, by mass, <0.06% C, ≥20% Ni, ≥27% Co, and 50 to 70% (Ni+Co), and comprising other element of ≤2.0% in total, and the balance Fe, and has an austenite single phase structure. In the alloy, the ratio between the average thermal expansion coefficient α1 in the range from 30°C to the displacement point (TA) of the inclination of a thermal expansion curve and the average thermal expansion coefficient α2 in the range from TA to 1,000°C, α2/α1 is ≤2.1, and TA is 500 to 750°C.


Inventors:
INOUE TAKESHI
UEHARA TOSHIHIRO
Application Number:
JP2002285299A
Publication Date:
April 15, 2004
Filing Date:
September 30, 2002
Export Citation:
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Assignee:
HITACHI METALS LTD
International Classes:
C04B37/02; C22C19/07; C22C30/00; C22C38/00; C22C38/10; C22C38/14; (IPC1-7): C22C38/00; C04B37/02; C22C19/07; C22C30/00; C22C38/10; C22C38/14