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Patent Searching and Data


Title:
METHOD FOR CUTTING Cu-Ga ALLOY AND METHOD FOR MANUFACTURING SPUTTERING TARGET
Document Type and Number:
Japanese Patent JP2013086238
Kind Code:
A
Abstract:

To provide a method for cutting a Cu-Ga alloy in which even a Cu-Ga alloy ingot with a relatively large Ga composition ratio can be cut into a desired shape without lowering productivity and without causing cracking or chipping.

The method for cutting the Cu-Ga alloy includes a heat treatment step and a slicing step. In the heat treatment step, the Cu-Ga alloy ingot 81 with a rectangular parallelepiped shape manufactured by melt casting is heat-treated under a temperature not less than 450°C but less than 700°C. Next, in the slicing step, the heat-treated Cu-Ga alloy ingot 81 is cut with a diamond band saw device 1 or a multi-wire saw device 10 in such a manner that a cut surface is perpendicular to the shortest side of the rectangular parallelepiped shape.


Inventors:
SATO HISAYA
YAMASHITA KAZUKI
Application Number:
JP2011231171A
Publication Date:
May 13, 2013
Filing Date:
October 20, 2011
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
B24B27/06; B23D53/00; C23C14/34
Attorney, Agent or Firm:
Keiichiro Saikyo