Title:
ＭＭＩＣ集積モジュール
Document Type and Number:
Japanese Patent JP5559901
Kind Code:
B1
Abstract:
PROBLEM TO BE SOLVED: To reduce the manufacturing costs of an MMIC integrated module while realizing the efficient output of electromagnetic waves.SOLUTION: A silicon substrate 12 where an antireflection structure 100 is formed on a surface is joined to an MMIC substrate 11. A dielectric plano-convex lens 13 formed by a given dielectric material is used as secondary radiation means of electromagnetic waves radiated into a housing.
Inventors:
Takuro Tajima
Naoya Kukutsu
Sheet pile 信
Son ホジン
Naoya Kukutsu
Sheet pile 信
Son ホジン
Application Number:
JP2013063694A
Publication Date:
July 23, 2014
Filing Date:
March 26, 2013
Export Citation:
Assignee:
Nippon Telegraph and Telephone CORP.
International Classes:
H01Q15/08; H01Q1/40; H01Q19/06
Domestic Patent References:
| JPH114118A | 1999-01-06 | |||
| JPH11231041A | 1999-08-27 |
Foreign References:
| WO1998015033A1 | 1998-04-09 | |||
| US5680139A | 1997-10-21 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Rie Kudo
Rie Kudo