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Patent Searching and Data


Title:
MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2011230167
Kind Code:
A
Abstract:

To provide a machining device capable of being miniaturized and enhancing an operating ratio of a line.

The machining device 10, which applies curl molding and seam molding to a workpiece W from the same direction, includes: an installation base 30 which is provided with a mold M for placing the workpiece W; a support 32 which is erected on the installation base 30 and elongated in one direction; a machining head 34 which is provided on the support 32; and a hoisting/lowering mechanism 36 for hoisting/lowering the machining head 34. The machining head 34 comprises a curling punch 58 for applying the curl molding to the workpiece W, a seaming punch 62 which is positioned above and ahead of the curling punch 58 and which applies the seam molding to the workpiece W, and a common base 48 which is provided with the curling punch 58 and the seaming punch 62.


Inventors:
TAO NOBURU
OKUNAKA HIROYUKI
SHIOBARA KENJI
Application Number:
JP2010103671A
Publication Date:
November 17, 2011
Filing Date:
April 28, 2010
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
B21D39/02
Domestic Patent References:
JP2002224765A2002-08-13
JPH05228557A1993-09-07
JPS4917843U1974-02-15
JP2000343156A2000-12-12
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Shuji Ouchi