PURPOSE: To make it possible to store semiconductor packages with various types of outer shapes and sizes in one magazine by providing a plurality of protuberances on the inner wall part of the magazine, facing inside with appropriate intervals.

CONSTITUTION: Protuberances 2 facing inside are provided on the lower inner wall surfaces of a magazine main body 1 which has a rectangular recessed part 8 facing upward at the center of the U shaped cross section, at both sides of the recessed part 8 with appropriate intervals. When the size of a package 3 is small, an outer lead 4 of the package 3 is stored in a space 5 which is divided and formed by the protuberances 2 and recessed part 8. In the meantime, when a large sized package 3 which is shown by imaginary line is stored, the outer lead 4 is stored in the space 5 on the outside, which is divided and formed by the protuberance and the side wall of the magazine main body 1. By this method, packages with different sizes can be stored in one magazine.