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Patent Searching and Data


Title:
MAGNETIC SHIELD MATERIAL
Document Type and Number:
Japanese Patent JPH04207000
Kind Code:
A
Abstract:

PURPOSE: To prevent the danger of electric shock during current leakage and the electromagnetic shield effect by creating a mold from a fiber or particles which are metal plated by electroless plating and a low temperature hardening resin which contains water, a water soluble polymer, or a water hardening substance.

CONSTITUTION: The material consists of fibers or particles which are metal plated by electroless plating and a low temperature hardening resin which contains water, a water soluble polymer, or a water hardening substance. The metal plated fiber consists of a synthetic fiber which is metal plated with nickel, copper, cobalt, gold, or silver by electroless plating and should be a short-length fiber less than 5cm, and preferably 1cm, for convenience. Further, the metal- plated particles should be about 0.1-1.5mm sized particles and any material which can be used with electroless plating is possible. As the low temperature hardening resin which contains water, low-temperature, preferably regular- temperature, hardening polyesters, epoxy resins, and modified acrylic acid-acrylic ester resins are included. As the water soluble polymer, there are synthetic materials such as polyvinyl alcohol and polyvinyl pyrlidone and as the water hardening substances, there are cement and gypsum.


Inventors:
YOSHIKAWA KAZUO
KASHIWAGI SHOJI
Application Number:
JP33949790A
Publication Date:
July 28, 1992
Filing Date:
November 30, 1990
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
H05K9/00; (IPC1-7): H05K9/00
Attorney, Agent or Firm:
Kikuchi Seiichi