Title:
MANUFACTURE OF CHIP BODY AND ADHESIVE SHEET USED IN THE MANUFACTURE
Document Type and Number:
Japanese Patent JP3468676
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily pick up a chip body by a method wherein an object, to be cut, is pasted on an adhesive sheet which is composed of a shrinkable film and of an adhesive layer, it is diced to form the chip body, the shrinkable film is shrunk and the contact area of the chip body with the adhesive layer is reduced.
SOLUTION: An object 5 to be cut is pasted on an adhesive layer 1 at an adhesive sheet 10, it is cut, and chips 6 are obtained. A cutting depth in a dicing operation is set in such a way that a shrinkable film 2 is cut completely up to the halfway part of a nonshrinkable film 4. A laminated body which is composed of the chips 6 and of the adhesive sheet 10 is heated, and the shrinkable film 2 is shrunk. Then, also the adhesive layer 1 is deformed so as to follow the shrinkage of the film 2, and the contact area of the chips 6 with the adhesive layer 1 is reduced. As a result, the adhesive force of the chips 6 to the adhesive layer 1 is reduced, and the chips can be picked up easily by means of a suction collet and without using a push-up pin.
Inventors:
Noguchi Hayato
Mineura Yoshihisa
Hideki Numazawa
Ebe Kazuyoshi
Mineura Yoshihisa
Hideki Numazawa
Ebe Kazuyoshi
Application Number:
JP33995597A
Publication Date:
November 17, 2003
Filing Date:
December 10, 1997
Export Citation:
Assignee:
Lintec Corporation
International Classes:
C09J7/02; C09J133/00; C09J175/04; C09J201/00; H01L21/301; H01L21/68; (IPC1-7): H01L21/301; C09J7/02
Domestic Patent References:
| JP8316177A | ||||
| JP337286A | ||||
| JP5283450A | ||||
| JP63205924A |
Attorney, Agent or Firm:
Shunichiro Suzuki