PURPOSE: To manufacture a framed circuit board excellent in high positional accuracy with high workability through the use of an adhesive sheet excellent in the uniformity of thickness and a specific die.
CONSTITUTION: A frame member 4 applied with an adhesive sheet 3 is fitted in the groove of a die with the adhesive face directing upward. A circuit board is then placed thereon and pressed from above thus bonding the frame member to the circuit board at predetermined positions thereof. A mold releasing film is peeled off the frame member which is then set in the second stage groove of a two stage die with the adhesive sheet directing upward. A circuit board 6 is then inserted into the first stage groove 8 and brought into contact with the adhesive sheet before the circuit board is pressed from above. The frame member 4 is set in the second stage groove of 0.8mm deep with the adhesive face directing upward followed by setting of the circuit board of 0.8mm thick in the first stage of 0.5mm thick. It is then thermocompressed for 30min at 160°C under the pressure of 0.5kg/cm2. This method realizes high positional accuracy without generating void due to insufficient adhesion.
HASHIMOTO KATSUHIRO
NAKAMURA MORIO
KAMEI KIYOO
TAKAHASHI SHIRO
OTAKE RIICHI
DAINIPPON INK & CHEMICALS