PURPOSE: To provide a method of manufacturing a multilayered circuit wiring board, wherein fine wirings are patterned and connected through viaholes by a conventional exposure/development process and a normal etching process.

CONSTITUTION: Required wiring patterns 2 and 3 are formed on the one side of an insulating base material 1, and a photosensitive insulating adhesive layer 4 is formed on the wiring patterns 2 and 3. The photosensitive insulating adhesive layer 4 is exposed to light so as to be separated into an unexposed region 4A located on a spot where a viahole is formed and an exposed region 4B. Another required wiring pattern 5A is formed on the exposed photosensitive insulating adhesive layer, and then the unexposed region 4A of the photosensitive insulating adhesive layer is removed by developing. Then, a curing treatment is carried out, and the exposed region 4B of the photosensitive insulating adhesive layer is formed on an insulating layer 4C. Lastly, a conductive layer 8 is formed on the exposed wiring pattern 2 and the other wiring pattern 5A so as to connect the patterns 2 and 5A together through the viahole.