Title:
MANUFACTURE OF ELECTROMAGNETIC WAVE SHIELDING MOLDING
Document Type and Number:
Japanese Patent JPH01138797
Kind Code:
A
Abstract:
PURPOSE:To improve a conductive layer in a property adhesive to a molded piece by a method wherein the conductive layer formed of a conductive fabric or a conductive knitting fabric is coated with a thermosetting resin and molten resin is supplied to a cavity as a mold is closed. CONSTITUTION:A polyester fabric is plated with copper through an electro-less plating method to be formed into a conductive fabric 1, which is dipped into a 15% acrylic resin solution by weight, and a solvent is evaporated so as to form a conductive material 3 composed of a conductive fabric which is coated with thermosetting resin. And, the conductive material 3 is placed between a molded piece inner layer forming core 4 and an outer layer forming cavity 5, and ABS resin 7 is supplied between the cavity and the conductive material 3 through a gate after the mold is closed, and thus a molded piece is molded in a piece with the conductive material 3 bonded to an inside face of it so as to form an electromagnetic wave shielding piece 8. The electromagnetic wave shielding piece 8 is obtained as mentioned above, where an adhesive property of the conductive material 3 is proved to be excellent through a heat cycle test, a heat resistance test, and a moisture resistance test performed basing on UL746C.
Inventors:
WATANABE ITSUO
RIKUKAWA MASAHIRO
YAMADA MITSUO
RIKUKAWA MASAHIRO
YAMADA MITSUO
Application Number:
JP17938987A
Publication Date:
May 31, 1989
Filing Date:
July 17, 1987
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B7/02; B29C45/14; B29C45/16; B32B5/02; H01B13/00; H05K9/00; (IPC1-7): B29C45/16; B32B5/02; B32B7/02; H01B13/00; H05K9/00
Domestic Patent References:
| JPS60177699A | 1985-09-11 |
Attorney, Agent or Firm:
Hirose Akira