PURPOSE: To obtain a heat dissipating member for a semiconductor chip mounting board, a heat sink, a heat dissipating fin, etc., having a thermal expansion coefficient similar to that of a semiconductor chip and excellent heat dissipation.
CONSTITUTION: The heat dissipating member is manufactured by forming a plating layer of Cu or Ag of 10-40wt.% by weight on surfaces of individual particles of W, Mo powder having a particle size of 3-10μm, molding.sintering the plating powder, and then rolling it by a pressing ratio of 50% or more of sectional reduction ratio. A rolled material having densified texture and a dense surface which have no inner defect is obtained. The rolled material is finished to a product of a necessary shape by punching, bending, etc. The product has a thermal expansion coefficient similar to that of a semiconductor chip of Si, etc., and no peeling, cracks, etc., do not occur due to a thermal stress to the chip or the package. Further, adhesive properties of the plating layer are satisfactory.
TAKESHIMA EIKI
SAKADO KENJI
UCHIDA KAZUKO
