Title:
MANUFACTURE OF HEAT SINK BUILT-IN TYPE CIRCUIT MOLDED OBJECT
Document Type and Number:
Japanese Patent JP3443872
Kind Code:
B2
Abstract:
PURPOSE: To provide a manufacturing method of a new heat sink built-in type circuit molded object wherein the manufacturing work efficiency of a circuit molded body provided with a heat sink is improved and miniaturization is easily attain.
CONSTITUTION: In the manufacturing method of a circuit molded body provided with a heat sink 2 for dissipating the heat of a mounting components 6, the heat sink 2 which is previously formed in a specified shape is arranged in a metal mold, and filled it with resin 1 or the like, thereby forming an injection- molded object 3 wherein the heat sink 2 is built in a unified body. After that, a necessary circuit is formed on the surface of the injection-molded object 3, and a mounting components 6 is fixed.
Inventors:
Toshiyuki Ohaku
Rikio Komakine
Yoshiyuki Ando
Ryo Sato
Hideki Asano
Rikio Komakine
Yoshiyuki Ando
Ryo Sato
Hideki Asano
Application Number:
JP12272093A
Publication Date:
September 08, 2003
Filing Date:
May 25, 1993
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
B29C45/14; H05K1/02; H05K3/00; B29L31/34; H05K1/00; (IPC1-7): H05K3/00; B29C45/14
Domestic Patent References:
| JP4253390A | ||||
| JP4335594A | ||||
| JP619866U |
Attorney, Agent or Firm:
Nobuo Kinutani
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