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Title:
MANUFACTURE OF INTEGRALLY FORMED SHEET WITH SKIN MATERIAL
Document Type and Number:
Japanese Patent JPH07275534
Kind Code:
A
Abstract:

PURPOSE: To easily and quickly bond pad and skin materials to each other integrally with a reactive hot melt adhesive, prevent the fall of raising on the upper surface of the skin material, shorten a crimping time, improve work efficiency and prevent the property deterioration of the pad material.

CONSTITUTION: A pad material 12 is placed in one of an upper die and a lower die, and a skin material 16 is placed in the other die. Also, the main section 12a of the pad material 12 is coated with a reactive hot melt adhesive 14. At the time of integrally bonding the materials 12 and 16 to each other, the surface of the section 12a coated with the adhesive 14 is heated from the upper side thereof by means of a heater and the adhesive 4 is thereby activated. Then, the materials 12 and 16 are pressed and attached to each other and integrally bonded.


Inventors:
KIKUCHI MASANOBU
YAGISHITA NORIO
YAMADA YOSHIJI
Application Number:
JP9053294A
Publication Date:
October 24, 1995
Filing Date:
April 05, 1994
Export Citation:
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Assignee:
IKEDA BUSSAN CO
International Classes:
B29C63/00; B29C63/02; B29C65/40; B68G7/05; B29K105/04; B29L31/58; (IPC1-7): B68G7/05; B29C65/40
Domestic Patent References:
JPH05329938A1993-12-14
JPH0615069A1994-01-25
JPH0639925A1994-02-15
Attorney, Agent or Firm:
Akiyama Osamu