To obtain a laminated ceramic electronic component which prevents a green chip from being bonded again by a method wherein, in a state that a green block is brought into contact with, and fixed to, a base film, the green block is cut to a prescribed size, the base film is stretched mechanically and the green chip is stripped from the base film.

Ceramic green sheets and internal electrodes are laminated alternately on the surface of an elastic rubber base film 4 which is brought into contact with, and fixed to, a metal board 3, and a laminated green block 1 is brought into contact and fixed. In this state, the laminated green block 1 is cut to a prescribed size, the base film 4 and the cut laminated green block 1 are stripped from the metal board 3, the base film 4 is stretched, and a green chip 1a as a cut piece from the cut laminated green block 1 is stripped from the base from 4. Thereby, it is possible to prevent the green chip 1a from being bonded again.