PURPOSE: To provide a method of manufacturing a layered ceramic electronic component in which grinding of a chip material is more effective and uniform than conventional, and in which a method of grinding is improved.

CONSTITUTION: In a method of manufacturing a layered ceramic electronic component, containing a step in which a chip-like electronic component material, a grinding media, and water are put in a container, which is ground by a barrel grinder, etc., the method is characterized by grinding in a condition that a grinding media and also a powdered abrasive coexist. It is possible to make more effective than before and to remarkably reduce contact fails with respect to an external electrode provided on a material end surface.