Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MANUFACTURE OF LEAD FRAME
Document Type and Number:
Japanese Patent JPH03209752
Kind Code:
A
Abstract:

PURPOSE: To obtain a lead frame wherein plating metal does not attach on the tip side surface of an inner lead, by a method wherein, after a lead frame is wrought and plated, release agent is brought into contact with the lead frame in the state that a region to be plated is coated, and a plated layer attaching on the unnecessary part is exfoliated and eliminated.

CONSTITUTION: By a stamping method, belt type material is wrought and molded in the shape of an ordinary lead frame including inner leads 4 facing a die pad 2, outer leads 8, a tie bar 7, etc. Through a coining process, a flat width of an inner lead tip is ensured and then the tip part is plated M. A lead frame wherein shaping and plating are finished in this manner is mounted on a plated layer releasing equipment, and the plated layers on unnecessary parts are exfoliated and eliminated. Said releasing equipment uses an electrolytic method; electric charges are generated by bringing an anode contactor 19 into contact with the lead frame; releasing liquid is sprayed via a cathode electrode 14; the negatively charged releasing liquid is supplied on the non-plated surface side of the lead frame.


Inventors:
MIYAJIMA KOJI
KAWAHARA SHOJI
Application Number:
JP419690A
Publication Date:
September 12, 1991
Filing Date:
January 11, 1990
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI HIGH TEC
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
JPS5760093A1982-04-10
JPH02182886A1990-07-17
Attorney, Agent or Firm:
Kimura Takahisa



 
Previous Patent: Hydrogen water manufacture machine

Next Patent: ELECTRONIC PARTS