Title:
MANUFACTURE OF LED DISPLAY ELEMENT
Document Type and Number:
Japanese Patent JPH03290983
Kind Code:
A
Abstract:
PURPOSE:To acquire an LED display element of high humidity resistance and high thermal strain resistance by holding an LED chip between two glass substrates and by sealing it by UV curing resin, etc. CONSTITUTION:An ITO film 2 is provided on a glass substrate 1, Ag paste 3 is applied and an LED chip 4 is mounted. An Au bump 5 is provided to the other side of the chip 4. A spacer 6 is provided to a periphery of the chip 4 in a thickness of 0 to -20% to a thickness of the chip. Epoxy resin 7 is applied to a periphery of the spacer 6 and treated for about 30 minutes at 100 deg.C. Then, UV curing resin 8 is applied to the Au bump 5, another glass substrate 1' provided with an ITO film 2' is laminated on the glass substrate 1 to hold the chip 4 and the spacer 6 therebetween, a pressure is applied from up and down, and UV light is irradiated to cure the resin; then, the Au bump 5 and the ITO film 2' are adhered tightly. While a pressure is applied, the Ag paste 3 and the epoxy resin 7 are treated at 200 deg.C for about 4 hours to complete a sealed LED display element.
Inventors:
FUNAKOSHI IZUMI
YONEDA KOTARO
TSUBOI TOSHIHIKO
YONEDA KOTARO
TSUBOI TOSHIHIKO
Application Number:
JP9173090A
Publication Date:
December 20, 1991
Filing Date:
April 06, 1990
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
G09F9/33; H01L33/40; H01L33/62; (IPC1-7): H01L33/00
Attorney, Agent or Firm:
Akimoto Teruo