To provide a manufacture of a multilayer-laminated board that can provide a highly reliable multilayer-laminated board without having void as well as set the insulation characteristics of the insulating layer, etc., as required.

A metal foil 4 is stacked on a circuit board 2 having circuits 1 on the surface via an insulating material 3, then heated all together under pressure to laminate the circuit board 2 and the metal foil 4 in this manufacture of a multilayer-laminated board. Thickness adjusters 5 that are generally as thick as the circuits 1 are provided in spaces where a circle of 10 mm or longer in diameter can fit between circuits 1 on the surface of the circuit board 2. Consequently, the thickness of the insulating layer formed with the insulating material 3 is made generally uniform so that characteristics such as insulating performance, etc., can be generally uniform. The insulating material 3 reaches every part between the circuits 1 or between the circuits 1 and the thickness adjusters 5.