Title:
MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH01143295
Kind Code:
A
Abstract:
PURPOSE:To form an outer layer circuit pattern having precision pattern width and gap, by using a two-sided copper coated laminated board whose copper foil of the outer layer face is thinner than that of the inner layer face thus providing a thin conductor of outer layer. CONSTITUTION:A through hole 4 is provided in a specified position of a two- sided copper coated lamination board 3 which is composed by applying a 5mum- thick copper foil 1 and an 18mum thick-copper foil 2 on both sides of an insulation board. Then a copper plating layer 5 is provided on the entire surface of the lamination board 3 and a circuit pattern 6 is formed on the face of the copper foil 2(18mum) and an outer layer board 7 is manufactured whose outer layer face is the face of the thin copper foil 1. Seventy two outer layer boards and an inner layer board 9 whereon an inner layer circuit pattern 8 is formed on the both sides respectively, are laminated with a plurality of prepregs 10 interposed therebetween, then heated and pressurized for lamination formation in one-piece construction. A through hole 11 is provided at a specified position of a multilayer board then a copper plating layer 12 is formed on the entire of the inner wall face of the hole 11 and outer layer face. A circuit pattern 13 is formed on the outer layer face by an ordinary method.
Inventors:
ENDO AKIRA
Application Number:
JP30137287A
Publication Date:
June 05, 1989
Filing Date:
November 28, 1987
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Saichi Suyama
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