PURPOSE: To effectively enable IVH connection and manufacture a multilayered wiring board of high density.
CONSTITUTION: An internal layer wiring 31 is formed, a metal foil 4 is bonded to internal layer wiring formation material via a resin layer, the metal foil 4 of a part corresponding with the connection part of the internal layer and the wiring is eliminated, the exposed resin layer 2 wherein the metal foil 4 is eliminated is chemically eliminated by using sulfonic acid, and the internal layer wiring 31 is exposed. Metal 72 which can resist etching solution of copper is deposited on the surfaces of the exposed internal wiring 31 and the copper foil 4. The metal 72 which can resist the etching solution of copper deposited on the copper foil where the surface of the exposed internal wiring layer 31 is excepted is eliminated, the copper foil 4 is eliminated, plating resist 10 is formed, and a wiring 11 is formed by nonelectrolytic plating. If necessary, the above process is repeated, and a multilayered structure is obtained.
HATAKEYAMA SHUICHI
SUGANO MASAO
NAKASO AKISHI
