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Title:
オプトエレクトロニクス部品の製造
Document Type and Number:
Japanese Patent JP7152483
Kind Code:
B2
Abstract:
The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.

Inventors:
schwarz thomas
Procel Andreas
Zorg Jorg
Application Number:
JP2020526365A
Publication Date:
October 12, 2022
Filing Date:
November 23, 2018
Export Citation:
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Assignee:
OSRAM OLED GmbH
International Classes:
H01L33/62; H01L23/28; H01L23/48
Domestic Patent References:
JP2017005150A
JP2005109172A
JP2013084700A
JP2017098470A
JP2003234367A
JP2013157357A
JP2017168691A
JP2012160638A
JP2010177329A
JP2002084004A
JP2017509155A
JP2004119631A
JP2007173562A
JP2009194026A
JP2008160046A
JP2009200321A
JP3169827U
JP2015535388A
Foreign References:
US20140117388
WO2012117974A1
Attorney, Agent or Firm:
Patent Attorney Corporation Washida International Patent Office