To make this device small and thin and also to surely perform electric continuity to a vibration element.

This method comprises a process which forms plural penetration holes on a 1st plate 1 that is constituted of a flat plate, a process which forms internal electrodes 3 at places where the penetration holes 2 on one surface of the plate 1 are covered, a process which forms external electrodes 11 at places where the holes 2 on the other surface of the plate 1 are covered, a process which sticks supporting bodies 5 that have plural spaces in their surfaces on the one surface of the plate 1, a process which mounts vibration elements 4 respectively in the spaces of the bodies 5, a process which glues a 2nd plate 6 that is constituted of a flat plate to cover all the spaces on the bodies 5 and a process which cuts a plate of a sandwich structure which is formed by the plate 1, the bodies 5 and the plate 6 to divide the penetration holes into two and makes a package case which has the element 4 internally.