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Patent Searching and Data


Title:
MANUFACTURE OF PRINTED CIRCUIT BOARD WITH CURVED SURFACE SHAPE
Document Type and Number:
Japanese Patent JPH03242992
Kind Code:
A
Abstract:

PURPOSE: To facilitate a work of providing a conductive circuit on a board of a curved surface shape by providing the circuit on at least one side surface of the board made of heat resistant thermoplastic resin, and then drawing it.

CONSTITUTION: After a conductive circuit is provided on at least one side surface of a board made of heat resistant thermoplastic resin, it is drawn. A base material for a printed circuit board is formed of the resin. As concrete resin, resin having high moldability and excellent high frequency characteristic such as polyetherimide, fluorine resin, etc., can be suitably used. Several sheets of films made of the resin are laminated, metal foils such as copper foils are placed on the outermost layers of one or both side surfaces, and thermally press-bonded at a melting point or higher of the used resin to be integrated. A circuit is formed on the foil of the surface by using the obtained flat board, and then drawn to a curved surface shape to be finally required by using a circuit formed board. Thus, a circuit forming work on the board having a curved surface shape such as a parabolic antenna, etc., is facilitated.


Inventors:
IWASAKI KANAME
NAGAMATSU KEIJI
SANO MITSUTOSHI
Application Number:
JP4069390A
Publication Date:
October 29, 1991
Filing Date:
February 21, 1990
Export Citation:
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Assignee:
MITSUBISHI PLASTICS IND
International Classes:
B32B15/08; H05K1/02; H05K3/00; H05K3/02; (IPC1-7): B32B15/08; H05K1/02; H05K3/00