Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH05121873
Kind Code:
A
Abstract:
PURPOSE: To realize cost reduction of a printed wiring board and high density of a pattern by changing the order of processes and by enabling processing of boring not by an NC drill but by carbonic acid gas laser light in a manufacturing method of a printed wiring board including a partly additive method.
CONSTITUTION: After a through-hole 3 is formed by boring by using not an NC drill but also carbonic acid gas laser light for formation of a through-hole of a copper foil circuit pattern 2 formed on a substrate 1, copper plating by partly additive method is performed for forming a through-hole 4 and a circuit pattern 5 of a copper plating layer.
Inventors:
OKUNO HISAKI
Application Number:
JP27952191A
Publication Date:
May 18, 1993
Filing Date:
October 25, 1991
Export Citation:
Assignee:
NEC CORP
International Classes:
B23K26/382; H05K3/42; (IPC1-7): B23K26/00; H05K3/42
Domestic Patent References:
| JPS60134493A | 1985-07-17 | |||
| JPS6197995A | 1986-05-16 |
Attorney, Agent or Firm:
Uchihara Shin