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Patent Searching and Data


Title:
MANUFACTURE OF RADIATION-PROOF ELECTRONIC CIRCUIT PACKAGE
Document Type and Number:
Japanese Patent JPH09181479
Kind Code:
A
Abstract:

To obtain a compact package with improved radiation shielding ability and good moldability by mixing heavy metal powder and binder material powder in an arbitrary ratio and holding the mixture at the temperature for dissolving the binder material powder in vacuum or in an inert gas atmosphere and then molding and solidifying it into an arbitrary shape.

Powder 1 of a heavy metal (or one with nickel plated on the surface thereof) such as tungsten having high radiation shielding power and powder 2 of a binder material such as lead, iron, etc., are mixed in a ball mill, etc., in an arbitrary ratio, and then the mixed powder is put in a mold, etc., and is held for an arbitrary time period at the temperature for dissolving the binder material powder. In this case, vacuum or an inert gas is used as the heating atmosphere depending on the material used. Consequently, the mold is pressed to solidify the mixed powder and is cooled to manufacture a blank. Thus, a compact package with improved radiation shielding ability and good moldability can be obtained.


Inventors:
KIMURA TAKASHI
KURODA YOSHIKATSU
Application Number:
JP34051895A
Publication Date:
July 11, 1997
Filing Date:
December 27, 1995
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
B22F1/02; B22F3/00; H05K9/00; (IPC1-7): H05K9/00; B22F1/02; B22F3/00
Attorney, Agent or Firm:
Akira Uchida (2 outside)