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Patent Searching and Data


Title:
MANUFACTURE OF RESIN MOLDED PRODUCT
Document Type and Number:
Japanese Patent JPH03140235
Kind Code:
A
Abstract:

PURPOSE: To enhance the adhesion between a surface layer part and a plated layer of a resin molded product comprised of a liquid crystalline polymer, by a method wherein a skin layer surface in a resin molded product main body is etched chemically, a skin layer is destroyed until the whole or a part of an etched hole arrives at an inner core layer and then the plated layer is formed on the skin layer with a dry plating method.

CONSTITUTION: A skin layer 2 of a molded product main body 1 is destroyed by etching chemically the surface of a resin molded product main body 1. Consequently, etched holes 21... are formed in the skin layer 2, part of which arrives up to an inner core layer 3. Then after neutralization of the etched resin molded product main body 1, the same is dehumidified by performing hot air drying. A plated layer 4 is applied to the skin layer 2 in succession, by plating aluminum by an ion plating method. With this dry plating, a resin molded product made of a liquid crystalline polymer constituted of the skin layer forming an oriented layer and the inner core layer forming an orientationless layer can be plated.


Inventors:
YUMOTO TETSUO
Application Number:
JP27836889A
Publication Date:
June 14, 1991
Filing Date:
October 27, 1989
Export Citation:
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Assignee:
SANKYO KASEI KK
International Classes:
B32B15/08; B32B7/04; H05K9/00; (IPC1-7): B32B7/04; B32B15/08; H05K9/00
Domestic Patent References:
JPS6254073A1987-03-09
JPH0192241A1989-04-11
Attorney, Agent or Firm:
Mitsuo Matsuda (3 others)