Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3022910
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which a semiconductor element is rigidly bonded to a supporting plate.
SOLUTION: A solder with paste 6 is applied on a principal surface 2a of a supporting plate 2, and a center part 6a of the solder with paste 6 is pressurized so that the solder with paste 6 is deformed into a recessed-like cross section in which the thickness of a peripheral part 6b of the solder with paste 6 is thicker than that of the center part 6a. Then, a semiconductor element 1 is pressurized onto the solder with paste 6 so that the entire surface of an other principal surface of the semiconductor element 1 in contact with the solder with paste 6 is uniformly and tightly brought into contact with the solder with paste 6, and a protruding part 6c higher than the other principal surface of the semiconductor element 1 is formed on the solder with paste 6 at the side of a side surface 1c of the semiconductor element 1.
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Inventors:
Masaharu Yoshizawa
Application Number:
JP3494397A
Publication Date:
March 21, 2000
Filing Date:
February 19, 1997
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L21/60; H01L21/52; (IPC1-7): H01L21/52
Domestic Patent References:
| JP59201433A |
Attorney, Agent or Firm:
Yoshito Nagata (1 person outside)