Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3441382
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To readily mount a reinforcing sheet to chips for protecting the chips from external forces.
SOLUTION: A method of manufacturing a semiconductor device has a first step of forming an integrated circuit on a semiconductor substrate (wafer 1), a second step of forming the side of the backside of this substrate (wafer 1) into a thin layer after this first process, a third step of sticking a reinforcing sheet 3 having a size to cover the whole region of the backside which is formed into a thin layer and protects the integrated circuit from a force applied from the outside, on the backside formed into the thin layer of the substrate (wafer 1) after this second step, and a fourth process of splitting the substrate (wafer 1) into a plurality of integrated circuit chips (IC chips 6) by cutting simultaneously the substrate (wafer 1) and the sheet 3 after the third step.
Inventors:
Hideyuki Unno
Manabu Hemmi
Shinichi Ohfuji
Masahiko Maeda
Manabu Hemmi
Shinichi Ohfuji
Masahiko Maeda
Application Number:
JP29204798A
Publication Date:
September 02, 2003
Filing Date:
October 14, 1998
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
G06K19/077; H01L21/00; H01L21/301; H01L21/56; H01L23/00; H01L23/16; H01L23/498; (IPC1-7): H01L21/301
Domestic Patent References:
| JP63253641A | ||||
| JP1167699A |
Attorney, Agent or Firm:
Masaki Yamakawa