MANUFACTURE OF SEMICONDUCTOR DEVICE

Japanese Patent JPH0487350

A

PURPOSE: To reduce the production cost of a semiconductor device by using a dicing to cut interfaces between semiconductor pellet areas to form a semicon ductor pellet, and followed by cutting a resin film along a dicing configuration of this semiconductor pellet 2.

CONSTITUTION: A semiconductor pellet 2 dice out from a semiconductor wafer is held in an inner lead 3A of a lead frame 3 via an insulating resin film 4, and this semiconductor pellet 2 is sealed with resin 1A. After that, a semiconduc tor element is formed on the surface of the semiconductor wafer followed by forming a plurality of semiconductor pellet formation areas on this semiconduc tor wafer, further followed by forming an insulating resin film 4 on the back opposite to the front surface of the semiconductor wafer, and furthermore followed by using dicing to cut interfaces between the semiconductor pellet formation areas to form semiconductor pellets 2 and cutting the insulating resin films 4 along the dicing configuration of these semiconductor pellets.

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SUZUKI KAZUNARI
KAJIWARA YUJIRO
TANAKA HIDEKI
TSUBOSAKI KUNIHIRO
TSUBOI TOSHIHIRO

JP20230590A

March 19, 1992

July 30, 1990

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HITACHI LTD
HITACHI MICROCUMPUTER ENG
HITACHI VLSI ENG

H01L21/56; H01L21/301; H01L21/78; H01L23/50; (IPC1-7): H01L21/56; H01L21/78

Akita Aki

Next Patent: SEMICONDUCTOR INTEGRATED CIRCUIT