PURPOSE: To make it possible to process and remove an oxide film deposited during the formation of a plasma CVD oxide film in a plasma reaction chamber at a high speed.
CONSTITUTION: After a first tri-nitrogen fluoride plasma processing is performed, the pressure is lowered than the pressure used for the first tri-nitrogen fluoride plasma processing. What is more, other plasma processing, which excludes the tri-nitrogen fluoride processing, is performed. Then, the pressure is increased to a higher pressure than the lower pressure plasma processing so as to perform a second tri-nitrogen fluoride plasma processing, thereby including a process which removes an oxide film deposited during the formation of a film in the plasma reaction chamber for the construction of this device.
TOKI MASAHIKO
OKUDA SHOJI
NAKAHIRA JUNYA
KIKUCHI HIDEAKI
FUJITSU VLSI LTD