To manufacture a shielding plate for a multilayer flexible wiring board which can be manufactured with the high productivity and which can contribute to the cost reduction by a method wherein a flexible circuit board and a flexible copper laminated board or a copper foil are formed continuously.

While a double-sided flexible circuit board 1 on which circuits are formed beforehand is paid off from a pay-off roll 2, adhesive composition 3 composed of thermoplastic resin, epoxy resin, curing agent and cure accelerator is applied to the one side of the circuit board 1 by a coater 4 so as to have its thickness after drying is 30μm and dried and semi-cured in an drying furnace 5. Then the applied side of the circuit board 1 is laminated with the insulating film side of a single-sided flexible copper laminated board 6 which is paid off from another pay-off roll 7 by heating rolls 8a and 8b whose temperature is 130°C which is higher than the softening point of the adhesive composition 3 and taken up. Further, the other side of the taken-up circuit board 1 is applied with the adhesive composition 3 and laminated with a single-sided flexible copper laminated board in the same way to manufacture a shielding plate 9 for a four-layer flexible interconnection board.